TECHNOLOGICAL RELIABILITY
The technological reliability is the ability of a product or a material to meet the working or use expectations over time.
This warranty can be obtained by simulating the stress conditions to which the product or the material is subjected during the life cycle, when the manufacturer must guarantee the functioning or the use to the customer.
GESTLABS can offer a service of wide-range technological reliability based on studies and experiments and focused on the specific required technology to evaluate the reliability in the requested operative conditions. The technologies go from the electronics to different industrial sectors (automotive, medical, aerospace, etc.) The offered service concerns the electronic components (included the solder joints and the printed boards), the materials (polymer, alloys, etc.) and the mechanical parts.
LAB TESTS
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Solder joints with lead-free alloys or solder pastes, by guaranteeing to the manufacturer their functionality during the life cycle of the product.e.
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Plastic materials used as electric product shells which, if exposed to environmental conditions, can lose the protection and insulation properties.
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Connectors with metal components subjected to wear and/or corrosion during the tim
VALIDATION PLANS
The validation plans are a structured series of tests and lab analysis able to verify and certify the capability of a product to do specific activities required by the technical specifications expected by the manufacturer.
GESTLABS has a consolidated experience in defining the validation plans on different products and technologies. The plans include several tests (climatic, mechanical, chemical) and the lab analysis necessary to cover a wide range of topics concerning different applications and failure mechanisms to be analysed.
The service includes the plan definition, and, upon customer request, the total or partial performing of the tests and the necessary lab analysis furnished with the consultation service on all the aspects concerning the validation.
MECHANICAL TESTS
(Shock & Vibrations)
The importance of the simulation in the transportation phases
When a finished product is ready to be launched on the market, the manufacturer must ensure that the packaging, according to the distribution system modes, allows the product to reach the destination with the most level of integrity, reliability, and safety.
The packaging is crucial: its function is to create a protection between the product and the outside environment, that means all the events which occur during its entire distribution cycle.
The easiest way to obtain information about the performances of a packaging during the transportation is to make packaging tests according to the commonest required standards (ISTA, ASTM, ISO, MIL-STD…).
The wrapped product is subjected to a series of tests focused on simulating the static and dynamic deformation to which it is potentially subjected during the transportation cycle: falls during the movement phases, vibrations caused by the transportation and the loads to which it is subjected during the storage.
LAB TESTS
At GEST Labs we can perform the following tests:
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Vibration Test (random and sinusoidal on X, Y, Z axes)
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Drop Test
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Shock test (semi-sinusoidal and trapezoidal pulses)
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Traction and Compression Tests
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Hardness Tests
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Tests performed in compliance with the international standards (MIL, IEC, IPC, ASTM) and/or customer’s requirements.
AVAILABLE EQUIPMENT
ANGELANTONI mod. CTS 157/2T
Type: Double chamber
Test:Thermal Cycle Chamber,
Thermal Shock Test
QUANTITY: 2
FEATURES: -60°C / +200°C
STANDARD PROFILES: -55°C / +125°C
Ramp rate: Transizione immediata
NECESSARY SIZES (LXHXP):530x450x660 mm
A.C.S. mod. CHALLANGE 250-TC
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 2
FEATURES: -55°C / +180°C
STANDARD PROFILES:
-40°C / +100°C
-55°C / +125°C
Ramp rate: 3°C / min
NECESSARY SIZES (LXHXP):
520x700x520 mm
MAZZALI mod. Thermair 700
TYPE: Thermal Oven
Test:
Cure & Bake
QUANTITY: 1
FEATURES: +150°C
STANDARD PROFILES: +40°C / +250°C
NECESSARY SIZES (LXHXP):
430x430x480 mm
ANGELANTONI CLIMATIC SYSTEM mod. HYGROS 600
TYPE: Climatic Chamber
Test:
Temperature,
Humidity,
Bias SOAK
QUANTITY: 2
FEATURES:
-40°C / +180°C,
10/98% RH
STANDARD PROFILES:
+85°C / 85% RH,
+30°C / 60% RH
DNECESSARY SIZES (LXHXP):
820x700x700 mm
SECASI mod. VRT50 C200 F70/5
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 1
FEATURES: -70°C / +200°C
STANDARD PROFILES:
-40°C / +65°C
-10°C / +150°C
Ramp rate: 10°C / min
NECESSARY SIZES (LXHXP):
340x340x435 mm
MAZZALI mod. Tesys 630H
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 1
FEATURES: -70°C / +180°C
STANDARD PROFILES:
-40°C / +100°C
-55°C / +125°C
Ramp rate: 7°C / min
NECESSARY SIZES (LXHXP):
700x1000x700 mm
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HTS (High Temperature Storage)
The aim of this ageing test is to characterise the quality of Intermetallic growth. It’s a long-duration and high-temperature test. 1000 hours and 125°C.
Technical regulations: IEC60068 (Environmental Tests Procedures)
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S.I.R. (Surface InsulationResistance)
This test method is used to quantify the damaging effects of manufacturing, movement processes or residues on SIR in case of humidity. The electrodes (electronically polarised during the conditioning to ease electro-chemical reactions) are placed on parallel traces on a printed circuit or on a standard assembled sheet. The samples are conditioned, and the measures are taken at a high level of humidity.
Test Method: IPC TM-650 2.6.3.7 (Surface Insulation Resistance)
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ATC (Accelerated Thermal Cycling)
The aim of this test is to evaluate the stress to which the soldering is subjected, according to the temperature variation. The ATC involves a slow temperature variation, not more than 20°C per minute. The thermal cycle provokes a different thermal expansion / contraction according to the material composition, by creating mechanical stresses which include plastic deformations on the material. This provokes a stress able to speed up the life cycle of the material. For example, the thermal cycle can cause micro-fractures inside the soldering, and, after several cycles, it can cause a total breakout.
Technical regulations: IEC60068 (Environmental Tests Procedures)
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T&H Temperature and Humidity
The aim of this test is to evaluate the impact of chemical substances on PCBA (for example fluxes residues). This test is performed according to the JEDEC JESD22-100C Standards and by respecting the following test parameters: a duration of 240 hours, with a temperature at 85°C and 85% of humidity. The result of the functional test is considered as positive if there is no dendritic growth.
Technical regulations: IEC60068 (Environmental Tests Procedures)
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Thermal Shock
The thermal shocks are different from thermal cycles because of the quick temperature change. For this reason, they provoke also different failure mechanisms. During the thermal shocks, the materials are subjected to deformation phenomena. On the PCBA they cause the PCB or assembled components deformation by creating a deformation perpendicular to the sheet surface.Technical regulations: IEC60068 (Environmental Tests Procedures)
SECASI mod. VRT50 C200 F50/3
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 2
FEATURES: -30°C / +200°C
STANDARD PROFILES:
0°C / +100°C
0°C / +125°C
Ramp rate: max 8°C / min
NECESSARY SIZES (LXHXP):
340x340x435 mm
VOTSCH mod. VC7018
TYPE: Climatic Chamber
Test:
Temperature,
Humidity,
Bias SOAK
QUANTITY: 1
FEATURES:
-75°C / +180°C,
10/98% RH
STANDARD PROFILES:
+85°C / 85% RH,
+30°C / 60% RH
NECESSARY SIZES (LXHXP):
580x750x450 mm
WEISS mod. WT1-480/70/15
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 1
FEATURES: -70°C / +180°C
STANDARD PROFILES:
-40°C / +100°C
-55°C / +125°C
Ramp rate: 12°C / min
NECESSARY SIZES (LXHXP):
800x1000x600 mm
VOTSCH mod. VC4057
TYPE: Climatic Chamber
Test:
Temperature,
Humidity,
Bias SOAK
QUANTITY: 3
FEATURES:
-40°C / +150°C
10/98% RH
STANDARD PROFILES:
+85°C / 85% RH,
+30°C / 60% RH
NECESSARY SIZES (LXHXP):
575x645x550 mm
ANGELANTONI CLIMATIC SYSTEM mod. TY150C/SP
TYPE: Single chamber
Test:
Thermal Cycle Chamber,
Temperature Cycling Test
QUANTITY: 1
FEATURES: -30°C / +150°C
STANDARD PROFILES: 0°C / +100°C
Ramp rate: 10°C / min
NECESSARY SIZES (LXHXP):
580x320x450 mm
VOTSCH mod. VC7012 S2
TYPE: Double chamber
Test:
Thermal Cycle Chamber,
Thermal Shock Test
QUANTITY: 1
FEATURES: -80°C / +200°C
STANDARD PROFILES: -55°C / +125°C
Ramp rate: Transizione immediata
NECESSARY SIZES (LXHXP):
470x650x410 mm
BIOBLOCK
TYPE: Thermal Oven
Test: Cure & Bake
QUANTITY: 1
FEATURES: +125°C
STANDARD PROFILES: +40°C / +200°C
NECESSARY SIZES(LXHXP):
430x450x460 mm